HSB04-171706
CUI Devices
Product No:
HSB04-171706
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 17 X 17 X 6 MM
Quantity:
Delivery:
Payment:
In Stock : 3251
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.7695
$0.7695
10
$0.7372
$7.372
25
$0.69996
$17.499
50
$0.68172
$34.086
100
$0.67241
$67.241
250
$0.626354
$156.5885
500
$0.589513
$294.7565
1000
$0.534252
$534.252
5000
$0.515831
$2579.155
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Product Information
Parameter Info
User Guide
| Shape | Square, Pin Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.236" (6.00mm) |
| Series | HSB |
| Thermal Resistance @ Forced Air Flow | 13.10°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 0.669" (17.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 29.73°C/W |
| Package | Box |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Width | 0.669" (17.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 2.5W @ 75°C |
| Package Cooled | BGA |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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