HSB22-606010

CUI Devices

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HSB22-606010

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HEAT SINK, BGA, 60 X 60 X 10 MM

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Shape	Square, Pin Fins
Material	Aluminum
Product Status	Active
Fin Height	0.394" (10.00mm)
Series	HSB
Thermal Resistance @ Forced Air Flow	2.60°C/W @ 200 LFM
Type	Top Mount
Length	2.362" (60.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	7.62°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	2.362" (60.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	9.8W @ 75°C
Package Cooled	BGA