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HSE07-753045

CUI Devices

Product No:

HSE07-753045

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

Delivery:

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Payment:

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In Stock : 971

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $3.23

    $3.23

  • 10

    $3.12075

    $31.2075

  • 25

    $3.0305

    $75.7625

  • 50

    $2.85019

    $142.5095

  • 100

    $2.561485

    $256.1485

  • 250

    $2.525404

    $631.351

  • 500

    $2.363049

    $1181.5245

  • 1000

    $2.326978

    $2326.978

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Product Information

Parameter Info

User Guide

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 1.772" (45.00mm)
Series HSE
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM
Type Board Level
Length 2.953" (75.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 4.85°C/W
Package Bag
Material Finish Black Anodized
Attachment Method Clip
Width 1.181" (30.00mm)
Diameter -
Power Dissipation @ Temperature Rise 15.46W @ 75°C
Package Cooled TO-218, TO-220