HSS-C2540-SMT-TR

CUI Devices

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HSS-C2540-SMT-TR

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HEAT SINK TO-263 COPPER

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In Stock : 150

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Shape	Rectangular, Fins
Material	Copper
Product Status	Active
Fin Height	0.450" (11.43mm)
Series	HSS
Thermal Resistance @ Forced Air Flow	5.50°C/W @ 200 LFM
Type	Board Level
Length	0.763" (19.38mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	21.90°C/W
Package	Tape & Reel (TR)
Material Finish	Tin
Attachment Method	-
Width	1.000" (25.40mm)
Diameter	-
Power Dissipation @ Temperature Rise	3.8W @ 75°C
Package Cooled	TO-263 (D²Pak)
Base Product Number	HSS-C2540