NXP USA Inc.
Product No:
OM13496UL
Manufacturer:
Package:
-
Batch:
-
Description:
SURFACE MOUNT TO DIP EVALUATION
Quantity:
Delivery:

Payment:
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| Series | - |
| Package Accepted | QSOP, TSSOP28, XFBGA, XQFN |
| Number of Positions | 16, 28 |
| Specifications | SMD to DIP |
| Kit Type | Adapter, Breakout Boards |
| Mfr | NXP USA Inc. |
| Quantity | 23 Pieces (4 Values - Mixed Quantities) |
| Package | Bulk |
| Product Status | Active |
| Base Product Number | OM13496 |